MIL MIL-PRF-31032/1D – Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting (see 6.1.1).
Product Details
- Published:
- 06/01/2017
- Number of Pages:
- 39
- File Size:
- 1 file , 660 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
