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Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-20 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Applies to semiconductor devices (discrete devices and integrated circuits) – and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
Product Details
Edition:
1.0
Published:
09/30/2002
Number of Pages:
49
File Size:
1 file , 1.7 MB
Note:
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