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IEC 60749-22 Ed. 1.0 b PDF
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Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength
IEC 60749-22 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements
Product Details
Edition:
1.0
Published:
09/12/2002
Number of Pages:
41
File Size:
1 file , 720 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
